CQDR Series, Cascading Quick Dump Rinser

Polypropylene and PVDF Cascading Quick Dump Rinser.

The CQDR Series Cascading Quick Dump Rinser utilizes top spray and bottom fill DI water rinsing techniques to provide an aggressive and consistent wafer rinse.  The large pneumatic door located at the bottom provides rapid dumping action, preventing recontamination on the wafer surface.

The CQDR Series is designed to be field retrofittable and can be used with most dump rinse controllers.  The CQDR is designed to be used with the Lufran UP Series Ultra Pure Deionized Water Heater for processes utilizing hot DI.

STANDARD FEATURES

• Standard 360° cascading overflow (knife edge).
• Hot Di compatible.
• Top spray and bottom fill manifolds.
• Single or dual dump doors.
• Can be used with most existing dump rinse controls.
• Natural Polypropylene, high density polyethylene or PVDF construction.
• Bottom fill valve has bypass flow capability.
• Rinser capacity from two 3" to two 8" wafer carriers. (Custom sizes also available.)
• Membrane controller is fully programmable and capable of multiple rinsing programs.
• Seal plate o-ring Viton, silicone or Kalrez.
• Diffuser Plate: PVDF with TFE fluoropolymer standoff legs.

BENEFITS

• Continuous cascade of residuals and contaminants.
• Rinser ready for hot DI on selected processes.
• Wafers thoroughly rinsed by top spray and bottom fill.
• Field retrofittable.
• Rinse to resistivity (option) ensures clean wafers entering the Spin Rinse Dryer (SRD), thus reducing rinse cycle.

OPTIONS

• N₂ or CO₂ injection available.
• Resistivity monitor.
• Systems with dual doors for DI H₂O reclaim.
• Virtually any size or configuration available, please consult factory.
• Rinser available with or without controller.
• Process cover.
• Ultra Pure DI Water Heater.
• Liquid level sensors.
• Seal plate o-ring. Viton standard, silicone and Kalrez also available.

*Fabricated

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